Application of simulation at the early stages of PCB design reduces the error count and leads to total cost savings. The professional analysis made by the engineers of the design of the “Skat-Pro” center will help to find the optimal compromise when designing the software.

Signal Integrity and Power Integrity Simulation

       The main feature of the development of digital technology in recent years is the speed increase. This fact poses a number of new challenges for the PCB developer. The concept of “high performance” depends on the specific project, the relative limit of high performance when considering the PCB can begin with the frequency of 50 MHz or for the signal front shorter than 1 ns.  When designing high-speed digital devices, it is of particular importance to take into account the nature of passive circuit elements, printed circuit conductors and integrated circuits housings, which are elements of the digital device design.

EMC Analysis

       Transmitting lines and components on PCBs are characterized by electromagnetic radiation (EMR). The board does not meet electromagnetic compatibility (EMC) requirements if the maximum EMR is higher than the EMC standard at any frequency.

Calculation of vibration resistance of printed-circuit boards and equipment design elements

       When designing electronic equipment operated in conditions of increased exposure to vibration, the developer faces the need to ensure its vibration resistance. Vibration resistance of the construction is estimated by the following parameters: its own vibration frequencies, deformations, stresses, vibration forms. These parameters can be estimated only by means of calculations.

Thermal analysis of printed circuit boards and electronic devices

       Designing modern electronic devices, the developer is increasingly faced with the need to solve the problem of providing thermal conditions. There are three main ways to solve this problem: free cooling, forced air cooling and liquid cooling. The use of calculation methods allows predicting the distribution of thermal fields in the structure and preventing unacceptable overheating in a timely manner.